| 논문명 | 현장측정 창-벽체 접합부 선형열관류율 도출을 위한 시뮬레이션 기초연구/A Preliminary Simulation Study on an In-situ Test Based Calculation of the Linear Thermal Transmittance of Wall-window Joints |
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| 저자명 | 최재솔(Choi, Jae-Sol) ; 김창민(Kim, Chang-Min) ; 장향인(Jang, Hyang-In) ; 김의종(Kim, Eui-Jong) |
| 발행사 | 한국건축친환경설비학회 |
| 수록사항 | 한국건축친환경설비학회 논문집 , Vol.14 No.2 |
| 페이지 | 시작페이지(171) 총페이지(12) |
| ISSN | 1976-6483 |
| 주제분류 | 환경및설비 |
| 주제어 | 창호시공하자; 열화상; 시뮬레이션; 선형열관류율 Window construction fault; Infrared thermography; Simulation; Linear thermal transmittance |
| 요약2 | This paper is a preliminary study on a quantitative evaluation of the thermal bridge through window-wall joint based on infrared thermography. The purpose of the work is to check the possibility of deducing the linear thermal transmittance from the thermal images, but in this preliminary work, the images were obtained not from an infrared camera but from simulations. A reference model is proposed to describe a construction defect case on the window-wall joint. Above all, the linear thermal transmittance of the defect case and the reference model was derived through the steady-state simulation. The reference model could describe the defective case showing a similar linear thermal transmittance when iteratively modifying a joint thermal property of the reference model. Surface temperatures of the surrounding area of the window were checked under unsteady conditions, and the temperature difference was 0.012°C on average. This result may show that the similar process can be performed but inversely in in-situ tests to get the linear thermal transmittance by modifying the joint property to match the thermal image and the simulated surface temperatures. |
| 소장처 | 한국건축친환경설비학회 |