| 논문명 | 창호-벽체 패키지 외피의 열교 부위 열성능 평가/Thermal Property Test for Thermal Bridges of Window-Wall Package Envelope |
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| 저자명 | 김혜림(Kim, Hye-Rim) ; 신상용(Shin, Sang-Yong) ; 최민호(Choi, Min-Ho) ; 안병립(Ahn, Byung-Lip) ; 성욱(Sung, Uk-Joo) |
| 발행사 | 한국건축친환경설비학회 |
| 수록사항 | 한국건축친환경설비학회 논문집 , Vol.13 No.4 |
| 페이지 | 시작페이지(223) 총페이지(11) |
| ISSN | 1976-6483 |
| 주제분류 | 환경및설비 |
| 주제어 | 창호-벽체 패키지 외피; 열교; 결로; 선형 열관류율; 내표면 온도차 비율 Window-Wall package envelope; Thermal bridge; Condensation; Linear thermal transmittance; Temperature Difference Ratio inside (TDRi) |
| 요약2 | Building components need to be developed as packages to commercialize Zero Energy Buildings (ZEB). This study aims to suggest the thermal property test and determination values for thermal bridges of window-wall package envelope. First, the legislations and standards regarding thermal properties of envelopes are reviewed. Second, the methods of thermal property test are described, which utilizes the condensation evaluation methods in KS F 2829, ISO 6781 and the linear thermal transmittance evaluation methods in ISO 10211. The determination values for window-wall package envelope certification are also suggested, which are based on KS F 2829 and Energy Performance Index (EPI). Third, the thermal property of manufactured window-wall package envelope was evaluated using the suggested testing methods. The Temperature Difference Ratio inside (TDRi) of the tested envelope was below 0.15 and the linear thermal transmittance of the tested envelope was below 0.4 W/m·K. Therefore, the tested envelope is certified that it has a good thermal property, low risks of condensation, and low risk of thermal bridge. |
| 소장처 | 한국건축친환경설비학회 |